半导体刻蚀工艺的优缺点是什么？ via first、trench first、partical via first、partical trench first工艺的优缺点？ 显示全部 关注者 2 被浏览 一体化刻蚀技术是将通孔刻蚀（via etch）、光刻胶灰化（pr strip）和沟槽刻蚀（trench etch）进行结合，在一道工艺中实现，从而大大节约了工艺时间和成本。 下面展示的是原本的via first. A ditch is wider than it is deep |___________| a trench is the opposite | | | | |_____| both of them are mostly found in the ground.
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